Process integration that realizes the rationalization of semiconductor wet processes.
If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
Our process integration solutions aim to streamline the wet processes in semiconductor manufacturing. Traditionally, wet etching, resist stripping, cleaning, and drying processes are often performed using individual equipment, which affects production efficiency and yield due to transportation between processes. Siconnex's batch spray system "BATCHSPRAY" allows for the use of multiple types of chemicals within a single chamber, enabling continuous processing of several wet processes without moving the wafers. This leads to reduced process time, space savings, and lower contamination risks. 【Features】 - Continuous processing of multiple wet processes in one chamber - Supports up to 8 types of process chemicals - Reduced contamination risk by minimizing wafer transport - Improved throughput through consolidated drying processes - Efficient use of space with a compact footprint design Additionally, it can be combined with ozone water processes (SicOzone) and organic solvent processes, allowing for the development of processes that consider reduced chemical usage and environmental impact. *For more details, please download the PDF document or feel free to contact us.*
- 企業：Siconnex Japan(サイコネックス ジャパン)
- 価格：Other
